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
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PROPERTIES Model X200, Thermal Conductivity W/(m.K) Minus 20℃: 0.023/ 0℃:0.025/ 10℃:0.027/ 25℃:0.028 Compressive strength (kPa) 200 Nominal Density (kg/m3) 26-31 Fire behavior Grade B1, Oxygen Index (%) 27.4 Applicable temperature Minus 20℃-Positive 25℃ Size (mm) 1200*600*60 Surface Smooth planing Edge Flat Application: Insulation & Energy-saving for roof, floor and walls
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Company: |
Beijing Beipeng SOHO Building Materials Group Co., Ltd
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Contact: |
Mr. Kevin KANG |
Address: |
F/16, Xingchuang Building, Daxing District, Beijing |
Postcode: |
102600 |
Tel: |
86 10 80225831 |
Fax: |
86 10 80222989 |
E-mail: |
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